Kyocera offers design options and proprietary material formulations to meet wide-ranging customer requirements
The main features of typical ceramic multilayer substrates are outlined below.
1. Superior Material Properties
- Higher flexural strength, higher rigidity (Young's Modulus of Elasticity)
- Coefficient of Thermal Expansion closer to that of Si
- Higher thermal conductivity
- Higher environmental reliability (resists humidity and heat)
2. Design Flexibility
- Multilayer structure
- Optional cavity structures
- 3D electrical interconnects among internal layers
- Plating/brazing technologies
Examples of Structures That Optimize Ceramic Package Features
Miniaturization
Multi Cavities (one side)
Multi Cavities (both sides)
Double Cavities (both sides)
Click here for details on miniaturization.
Click here for details on designs and structures.
Examples of Package Mounting Options
Other Key Technologies Supporting Innovation
Thin-Film Technology
Wiring Technology: (Thick / Thin Film)
Integrated Simulation Capabilities
Material Options
Bonding Dissimilar Materials
Offering a Wide Variety of Package Designs and Structures
Co-Firing Technology
Plating Technologies for Multilayer Ceramic Packages
3D Structures / 3D Electrical Interconnects
Customized Optical Window Lid Design
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